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A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or ``pins") where multiple integrated circuits (ICs), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it is treated as if it were a single component (as though a larger IC).〔Rao Tummala, Solid State Technology. “(SoC vs. MCM vs SiP vs. SoP ).” Retrieved August 4, 2015.〕 Other terms, such as "hybrid" or Hybrid integrated circuit, also refer to MCMs. ==Overview== Multi-Chip Modules come in a variety of forms depending on the complexity and development philosophies of their designers. These can range from using pre-packaged ICs on a small printed circuit board (PCB) meant to mimic the package footprint of an existing chip package to fully custom chip packages integrating many chip dies on a High Density Interconnection (HDI) substrate. Multi-Chip Module packaging is an important facet of modern electronic miniaturization and micro-electronic systems. MCMs are classified according to the technology used to create the HDI (High Density Interconnection) substrate. * MCM-L – laminated MCM. The substrate is a multi-layer laminated PCB (Printed circuit board). * MCM-D – deposited MCM. The modules are deposited on the base substrate using thin film technology. * MCM-C – ceramic substrate MCMs, such as LTCC. 抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』 ■ウィキペディアで「Multi-chip module」の詳細全文を読む スポンサード リンク
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